Thermal stability of electroplated copper thin-film interconnections
作者： Pornvitoo Rittinon , Ken Suzuki , Hideo Miura
DOI: 10.1109/3DIC.2015.7334560
关键词:
摘要: There were local distributions of the crystallinity and resistance in a test interconnection. The interconnection varied with crystallinity. maximum temperature appeared area minimum crystallinity, other words, highest under application high current density 10 MA/cm2. Thus, Joule heating occurred due to variation decreased from about 170°C 140°C when average (IQ value which was obtained EBSD analysis) increased 3000 4100. This decrease can be explained by fixed density. long-term reliability interconnections drastically.
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