Package structure for radio frequency module and manufacturing method thereof
作者： Jian-Cheng Chen
DOI:
关键词:
摘要: A package structure for radio frequency module and a manufacturing method thereof are provided. The includes multi-layer substrate, first chip, second number of solder bumps, molding compound compound. substrate metallic middle layer has surfaces. the chips respectively disposed on surfaces electrically connected to substrate. is surface covers chip. bumps via chip encircles sidewalls connection exposed outside
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