Stacked multi-chip package with EMI shielding
作者： Yu-Chih Chen , Chang Hwa Chung , Man-Lung Sham , Lap Wai Leung
DOI:
关键词:
摘要: A stacked multi-chip package with an EMI shielded component has first and second substrates mounted together by a grid array of metallic connecting nodes, such as solder Ball Grid Array. Each substrate conductive plane associated it. An electronic is between the surrounded group nodes that are also electrically connected to planes both form Faraday cage about component.
lens.org 参考文章(15)
Bruce J. Freyman, Frank J. Juskey, Barry M. Miles, Keith D. Soldner, Transfer molded semiconductor device package with integral shield ,(1991)
Stefano Oggioni, Giuseppe Vendramin, Ball grid array module ,(2003)
Kartik M. Sridharan, Guruswami M. Sridharan, Integrated circuit die having an interference shield ,(2002)
Craig S. Mitchell, Apolinar Alvarez, Belgacem Haba, Substrate for a microelectronic package and method of fabricating thereof ,(2012)
Steven Scheifers, Cynthia M. Melton, Carl J. Raleigh, Noncollapsing multisolder interconnection ,(1990)
Thomas Dixon Dudderar, Meng Zhao, Yinon Degani, Liguo Sun, Stacked module package ,(2001)
Marcos Karnezos, Flynn Carson, Method for making a semiconductor multi-package module having inverted wire bond carrier second package ,(2007)
James A. Blanton, Method of providing standoff pillars ,(1990)
William Edward Sablinski, Jeffrey Thomas Coffin, Mario Interrante, Jeffrey Allen Zitz, Megan Shannon, Brenda Lee Peterson, Christopher Todd Spring, Michael Anthony Gaynes, David James Alcoe, Renee Weisman, Randall Joseph Stutzman, Harvey Charles Hamel, Emi shielding for electronic packages ,(2002)
Kurt C. Conrath, Nicolaas H. Worp, Bruce J. Freyman, Overmolded semiconductor package with anchoring means ,(1990)