Method for making a semiconductor multi-package module having inverted wire bond carrier second package
作者： Marcos Karnezos , Flynn Carson
DOI:
关键词:
摘要: A semiconductor multi-package module has stacked lower and upper packages, each of which includes a die attached to substrate, in the second package is inverted, substrates are interconnected by wire bonding, inverted comprises bond carrier package. Also, method for making module, providing molded including substrate die, affixing an orientation onto surface package, forming z-interconnects between substrates.
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