Integrated circuit stacked package precursors and stacked packaged devices and systems therefrom
作者： Peter R. Harper , Kenneth Maggio
DOI:
关键词:
摘要: A package-on-package (POP) package precursor and packaged devices systems therefrom includes an electronic substrate including electrically conductive layers a top surface. first portion of the surface has IC die attached thereon. second plurality attach pads on opposing sides for coupling to device die. At least third is positioned laterally with respect portion. The at device. one trace that couples and/or or more pads.
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