Package-on-package secure module having bga mesh cap
作者： Ruben C. Zeta , David D. Eaton , David R. Staab
DOI:
关键词: Printed circuit board 、 Microcontroller 、 Package on package 、 Ball grid array 、 Integrated circuit 、 Polygon mesh 、 Embedded system 、 Substrate (printing) 、 Engineering
摘要: A package-on-package (POP) secure module includes a BGA mesh cap, first package, and second package. The package integrated circuit (for example, microcontroller that tamper detect logic). memory). is piggy-back mounted to the cap printed board substrate member of an embedded anti -tamper mesh. This connected in protected manner within circuit. When use, underlying coupled so both meshes are controlled by logic.
lens.org参考文章(22)
Marcos Karnezos, Seng Guan Chow, Byung Joon Han, Il Kwon Shim, Kambhampati Ramakrishna, Semiconductor assembly including chip scale package and second substrate and having exposed substrate surfaces on upper and lower sides ,(2006)
Stefano Oggioni, Vincenzo Condorelli, Nihad Hadzic, Tamper-proof caps for large assembly ,(2006)
Brant Candelore, Anti-tamper bond wire shield for an integrated circuit ,(1998)
Raymond O. Chock, Peter C. Hsiang, Mark Hess, Secure transaction microcontroller with secure boot loader ,(2004)
Justin H. Benson, Charles McCown, John I. Daspit, Security module system, apparatus and process ,(2001)
Mike Brooks, Salman Akram, Multiple die package ,(2001)
Gary Schwenck, Mark Corio, Keith Alexander Harrison, Tamper-evident/tamper-resistant electronic components ,(2002)
Fritz Kömmerling, Oliver Kömmerling, Anti tamper encapsulation for an integrated circuit ,(2000)
Carl Knudsen, Tamper resistant packaging and approach ,(2003)