Method of increasing the layout efficiency of dies on a wafer, and increasing the ratio of i/o area to active area per die
作者： Michael D. Rosotker
DOI:
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摘要: Certain non-square dies, such as triangular greatly elongated rectangular parallelogram trapezoidal, and the like, are able to be laid out in area of a circular semiconductor wafer more "efficiently" than square dies. Further, peripheral these certain dies is advantageously increased relative contained within area, accommodate I/O connections active elements die.
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