The Next Generation Router System Cooling Design

Jie Wei, Masahiro Suzuki, Thermal Management of Fujitsu High-End Unix Servers Advances in Electronic Packaging, Parts A, B, and C. pp. 469- 475 ,(2005) , 10.1115/IPACK2005-73313

H. Y. Zhang, D. Pinjala, Flow Boiling Heat Transfer in Microchannel Heat Sinks of Different Flow Orientations Advances in Electronic Packaging, Parts A, B, and C. pp. 51- 58 ,(2005) , 10.1115/IPACK2005-73041

R.C. Chu, R.E. Simons, M.J. Ellsworth, R.R. Schmidt, V. Cozzolino, Review of cooling technologies for computer products IEEE Transactions on Device and Materials Reliability. ,vol. 4, pp. 568- 585 ,(2004) , 10.1109/TDMR.2004.840855

Kanchan M. Kelkar, Suhas V. Patankar, Sukhvinder Kang, Computational Method for Characterization of a Microchannel Heat Sink Involving Two-Phase Flow Advances in Electronic Packaging, Parts A, B, and C. pp. 151- 160 ,(2005) , 10.1115/IPACK2005-73119

Shankar Krishnan, Suresh V. Garimella, Gregory M. Chrysler, Ravi V. Mahajan, Towards a Thermal Moore's Law IEEE Transactions on Advanced Packaging. ,vol. 30, pp. 462- 474 ,(2007) , 10.1109/TADVP.2007.898517

Timothy J. Dake, Joseph Majdalani, Susheela Narasimhan, Design Optimization of a Router Board Using Computational Fluid Dynamics 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2. pp. 35- 39 ,(2003) , 10.1115/IPACK2003-35338

M. Gao, Y. Cao, Flat and U-Shaped Heat Spreaders for High-Power Electronics Heat Transfer Engineering. ,vol. 24, pp. 57- 65 ,(2003) , 10.1080/01457630304071

Je-Young Chang, Ravi Prasher, David Chau, Alan Myers, John Dirner, Suzana Prstic, Dongming He, Convective Performance of Package Based Single Phase Microchannel Heat Exchanger Advances in Electronic Packaging, Parts A, B, and C. pp. 183- 188 ,(2005) , 10.1115/IPACK2005-73126