Review of cooling technologies for computer products
作者： R.C. Chu , R.E. Simons , M.J. Ellsworth , R.R. Schmidt , V. Cozzolino
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摘要: … The role of internal and external thermal resistance in module level cooling is discussed in terms of heat removal from chips and module and examples are cited. The use of air-…
sci-hub.se 参考文章(47)
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