Method and apparatus for cooling an equipment enclosure through closed-loop liquid-assisted air cooling in combination with direct liquid cooling
作者： Paul W. Coteus , John P. Karidis , Shurong Tian , Shawn A. Hall , Evan G. Colgan
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摘要: A method and an apparatus for cooling, preferably within enclosure, a diversity of heat-generating components, with at least some the components having high-power densities others low-power densities. Heat generated by essentially relatively few high-power-density such as microprocessor chips example, is removed direct liquid whereas heat more numerous or low-watt-density memory liquid-assisted air cooling in form closed loop comprising plurality heating zones that alternate along path.
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