作者: Richard C. Chu , Omkarnath R. Gupta , Un-Pah Hwang , Robert E. Simons
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摘要: A gas encapsulated cooling unit is provided for one or more heat generating components mounted on a substrate. conductive cap sealed to the substrate enclosing components. The wall of opposite contains elongated openings therein extending towards and same centers with respect thereto. resilient member located in communion inner end openings. thermal element each forming small peripheral gap between opening associated element. urges elements into pressure contact inert within filling gaps interfaces elements. removed from by external removal means.