High density lsi package for logic circuits

摘要: A multichip package is comprised of a substrate having grid input and output pins disposed on an under surface. Power supply grounding wire layers are embedded in the substrate. An upper surface has plurality thin separated by at least one insulating layer. via holes layer permit conductive interconnection layers. leadless chip carriers have tape automated bonding leads that inner lead bonded to The chips directly connected carrier terminals connect terminal pads. cover made highly heat material contacts back side mounted chip.