Organic Dielectrics in Multilevel Metallization of Integrated Circuits

摘要: Publisher Summary This chapter concentrates on the properties and processing of organic dielectric materials. Multilevel metal/dielectric interconnection technology strongly impacts chip size performance, plays an important part in cost, yield, reliability. Therefore, several considerations are involved changing from one wiring/dielectric scheme to another. The most common dielectrics used as multilevel metal materials that can withstand high temperatures, have low constants, easily integrated with semiconductor classes form known polymers. Several leading candidates for emerged due their combinations superior processability, thermal stability, properties. widely class is polyimides because chemistry Polyimides a general compounds, which consist polyamic acid monomer. Upon polymerization, these compounds undergo condensation reactions polyimide polymer chains. performance advantages offer make them attractive designing advanced chips packages. In order take full advantage materials, process must be designed, fully integrates metallization steps polymer. One main attractions cost; fact, many cost-performance offerings. Photosensitive particularly attractive, photoresist apply-and-remove may eliminated.