Multi-layer thin-film substrates for multi-chip packaging

摘要: It is commonly recognized that multiple chip module (MCM) packaging offers great advantages in system performance by virtue of the elimination an entire level interconnection. Multilayer thin-film technologies for high-performance were developed and integrated. The technologies, which feature four copper layers, polyimide dielectric, controlled-impedance transmission lines, solder bump assembly, demonstrated on a variety vehicles including, recently, 4-kbyte RAM operating at above 100-MHz clock frequency. generic MCM substrate technology described. process can be designed to compatible with number materials as required specific applications. >