Functionalized KIT‐6/Terpolyimide composites with ultra‐low dielectric constant

摘要: Polyimides with low dielectric constants are important raw materials for the fabrication of flexible printed circuit boards and other microelectronic applications. As creation voids in polyimide matrix could decrease constant, this study mesoporous KIT-6, synthesized hydrothermally, was functionalized 3-aminopropyltriethoxysilane (APTS) mixed 4,4′-oxydianiline (ODA) synthesis terpoly(amic acid) using 3,3′,4,4′-biphenyldianhydride (BPDA), 3,3′,4,4′-oxydiphthalic dianhydride (ODPA) 3,3′,4,4′-benzophenonetetracarboxylic (BTDA) subsequently stage-cured to obtain APTS-KIT-6/Terpolyimide composites (APTS-KIT-6/TPI). The asymmetric symmetric vibrations imide OCNCO groups APTS-KIT-6/TPI showed their peaks at 1772 1713 cm−1. constant decreased increase KIT-6 loading from 2 4%, but increased higher loadings, 4% it 1.42. Its tensile strength (103 MPa), modulus (2.5 GPa), percentage elongation (8.2) high thermal stability (>540°C) were also adequate application microelectronics such as circuits. © 2014 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2014, 131, 40508.