Indirect bonding of Ni-electroless plated AlN and Cu by hot pressing method

摘要: The electroless Ni (EN) plating method was employed to metallize the AlN ceramic substrates. EN-plated substrate bonded with Cu foil form a sandwich-like AlN-EN/Cu/EN-AlN assembly by hot pressing in vacuum pressure of 6.5 MPa for 30 min. For bonding temperature below Ni-P eutectic EN at 880/spl deg/C, samples were through solid state diffusion. On other hand, via liquid phase media both wetting and diffusion if above deg/C. An optimum adhesion strength around 10 occurred within range 600-700/spl fracture took place EN/Cu interface 600/spl while AlN/EN 700/spl increasing enhanced interdiffusion strong bond, yet resulted large residual thermal stress interface. as-received AM exhibited higher than those polished because there existed compression perpendicular surface irregularities AlN, which an additional shear offset test. etched highest as compared although roughness same that one. It is argued micro-etched holes provides anchor sites interlocking film, results good mechanical joint. However, trimming on edges would damage joint, low instead observed. >