Thick film metallization of AlN substrate with Cu conductive pastes

摘要: Metallization of AlN substrate is employed with Cu conductive pastes through a thick-film screen printing process. The morphological development the conductive/substrate interface and element distribution compound precipitates are investigated aid electron microscopy X-ray diffraction. For higher sintering temperature paste 1, reaction PbO/sub 2/ W forms PbWO/sub 4/ results in reduction Cu/sub 2/O to metallic Cu. as-sintered 1 metallized specimen exhibits adhesion strength than lower sintered 2 specimen. It argued that more highly densified film morphology, formation, mechanical interlocking major factors enhancement strength. also observed atmosphere has significant effect on near interface. >