Thermal conductivity and sound velocity measurements of plasma enhanced chemical vapor deposited a-SiC:H thin films

作者: D.B. Hondongwa , L.R. Olasov , B.C. Daly , S.W. King , J. Bielefeld

DOI: 10.1016/J.TSF.2011.05.014

关键词:

摘要: Abstract We report ultrafast optical measurements of the thermal conductivity and longitudinal sound velocity for a-SiC:H thin films deposited by plasma enhanced chemical vapor deposition (PECVD). Porous non-porous with mass densities ranging from 1.0–2.5 g/cm3 were obtained intentionally varying PECVD process conditions. The velocities these materials as determined picosecond ultrasonics ranged 2370 m/s to 10460 m/s, Young's modulus 5–200 GPa. Time domain thermoreflectance range 0.0009 W/cmK 0.042 W/cmK.

参考文章(30)
M. R. Baklanov, M. Van Hove, G. Mannaert, S. Vanhaelemeersch, H. Bender, T. Conard, K. Maex, Low temperature oxidation and selective etching of chemical vapor deposition a-SiC:H films Journal of Vacuum Science & Technology B. ,vol. 18, pp. 1281- 1287 ,(2000) , 10.1116/1.591375
Ebrahim Andideh, Michael Lerner, Gerald Palmrose, Safaa El-Mansy, Tracey Scherban, Guanghai Xu, Jeanette Blaine, Compositional effects on electrical and mechanical properties in carbon-doped oxide dielectric films: Application of Fourier-transform infrared spectroscopy Journal of Vacuum Science & Technology B. ,vol. 22, pp. 196- 201 ,(2004) , 10.1116/1.1640401
S.W. King, J.A. Gradner, Intrinsic stress fracture energy measurements for PECVD thin films in the SiOxCyNz:H system Microelectronics Reliability. ,vol. 49, pp. 721- 726 ,(2009) , 10.1016/J.MICROREL.2009.04.006
Y. Cai, M. F. Thorpe, Floppy modes in network glasses. Physical Review B. ,vol. 40, pp. 10535- 10542 ,(1989) , 10.1103/PHYSREVB.40.10535
M. Shamsa, W. L. Liu, A. A. Balandin, C. Casiraghi, W. I. Milne, A. C. Ferrari, Thermal conductivity of diamond-like carbon films Applied Physics Letters. ,vol. 89, pp. 161921- ,(2006) , 10.1063/1.2362601
Sun Rock Choi, Dongsik Kim, Sung-Hoon Choa, Sung-Hoon Lee, Jong-Kuk Kim, Thermal Conductivity of AlN and SiC Thin Films International Journal of Thermophysics. ,vol. 27, pp. 896- 905 ,(2006) , 10.1007/S10765-006-0062-1
K. Maex, M. R. Baklanov, D. Shamiryan, F. lacopi, S. H. Brongersma, Z. S. Yanovitskaya, Low dielectric constant materials for microelectronics Journal of Applied Physics. ,vol. 93, pp. 8793- 8841 ,(2003) , 10.1063/1.1567460
David G. Cahill, Analysis of heat flow in layered structures for time-domain thermoreflectance Review of Scientific Instruments. ,vol. 75, pp. 5119- 5122 ,(2004) , 10.1063/1.1819431