Theoretical prediction of thermodynamic activities of all components in the Bi-Sb-Sn ternary lead-free solder system and Pb-Bi-Sb-Sn quaternary system
作者： O.E. Awe , O.M. Oshakuade
DOI: 10.1016/J.TCA.2014.05.009
关键词:
摘要: Abstract Thermodynamic activity of Sn in the ternary lead-free solder, Bi-Sb-Sn has been predicted at 900 K using molecular interaction volume model (MIVM). The results obtained have good agreement with available experimental data. On this premise, we activities all components three cross-sections from corner each metal molar ratio other two being 1:3, 1:1 and 3:1 range 500–1000 K. We found that Bi show a transformation negative deviation Raoult's law to positive while Sb shows law. also out increase temperature decreases determines extent Bi. Pb-Bi-Sb-Sn 700 K were predicted.
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