Effects of Pb contamination on the eutectic Sn‐Ag solder joint
作者： S. Choi , T.R. Bieler , K.N. Subramanian , J.P. Lucas
DOI: 10.1108/09540910110385220
关键词: Ternary operation 、 Differential scanning calorimetry 、 Phase (matter) 、 Materials science 、 Melting point 、 Metallurgy 、 Soldering 、 Printed circuit board 、 Eutectic system 、 Microstructure
摘要: Eutectic Sn‐Ag solder is being considered as a potential replacement for Sn‐Pb solders. A drawback to using the eutectic its higher melting point, 221°C, compared with Pb‐Sn solder. Owing temperature, also automotive under‐the‐hood applications, which experience high temperature environments. Electronic components and/or circuit boards are often coated Pb‐bearing facilitate soldering operations. Soldering will result in joints contaminated Pb. In this study, effects of Pb contamination on were investigated three ternary alloys made by incorporating some into These all showed peak at 178°C heating curves obtained Differential Scanning Calorimetry (DSC), resulted from composition Sn‐Ag‐Pb system. The phases found be dispersed throughout microstructure. practical implication that service such would limited lower phase.
sci-hub.se 参考文章(17)
Wilhelm Hofmann, Lead and Lead Alloys Lead and Lead Alloys. pp. 25- 320 ,(1970) , 10.1007/978-3-662-28508-4_2
W. J. Tomlinson, A. Fullylove, Strength of tin-based soldered joints Journal of Materials Science. ,vol. 27, pp. 5777- 5782 ,(1992) , 10.1007/BF01119737
Paul T. Vianco, An Overview of Surface Finishes and Their Role in Printed Circuit Board Solderability and Solder Joint Performance Circuit World. ,vol. 25, pp. 6- 24 ,(1999) , 10.1108/03056129910244518
M. McCormack, S. Jin, New, lead-free solders Journal of Electronic Materials. ,vol. 23, pp. 635- 640 ,(1994) , 10.1007/BF02653349
Chad M. Miller, Iver E. Anderson, Jack F. Smith, A viable tin-lead solder substitute: Sn-Ag-Cu Journal of Electronic Materials. ,vol. 23, pp. 595- 601 ,(1994) , 10.1007/BF02653344
Yoshiharu Kariya, Yasunori Hirata, Masahisa Otsuka, Effect of thermal cycles on the mechanical strength of quad flat pack leads/Sn-3.5Ag-X (X e Bi and Cu) solder joints Journal of Electronic Materials. ,vol. 28, pp. 1263- 1269 ,(1999) , 10.1007/S11664-999-0166-Z
I. Artaki, A. M. Jackson, P. T. Vianco, Evaluation of lead-free solder joints in electronic assemblies Journal of Electronic Materials. ,vol. 23, pp. 757- 764 ,(1994) , 10.1007/BF02651370
W.B. Hampshire, The Search for Lead‐free Solders Soldering & Surface Mount Technology. ,vol. 5, pp. 49- 52 ,(1993) , 10.1108/EB037826
Wenge Yang, Robert W. Messler, Lawrence E. Felton, Microstructure evolution of eutectic Sn-Ag solder joints Journal of Electronic Materials. ,vol. 23, pp. 765- 772 ,(1994) , 10.1007/BF02651371
Yoshiharu Kariya, Masahisa Otsuka, Effect of bismuth on the isothermal fatigue properties of Sn-3.5mass%Ag solder alloy Journal of Electronic Materials. ,vol. 27, pp. 866- 870 ,(1998) , 10.1007/S11664-998-0111-6