Thermodynamic analysis of influence of Pb contamination on Pb-free solder joints reliability
作者： Xianzhang Zeng
DOI: 10.1016/S0925-8388(02)00855-1
关键词:
摘要: Abstract Because the infrastructure for electronic component manufacturing is not ready Pb-free processing, Pb contamination of solder joints cannot be avoided in near future. In this work thermodynamically calculated phase diagrams are used to analyze formation microstructure Pb-contaminated Sn–Ag, Sn–Ag–Cu, and Sn–Bi joints. Non-equilibrium effect solidification on considered. Due high cooling rate, joint prone non-equilibrium eutectic structure. The influence structure reliability discussed.
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