Materials behaviour and intermetallics characteristics in the reaction between SnAgCu and Sn-Pb solder alloys

摘要: This paper illustrates the application of thermodynamic modelling techniques that are capable simulating and predicting a range interacting physical phenomena associated with behaviour multicomponent Sn-Pb/Pb-free solders in relation to solder joint manufacture long term reliability. The compares theoretical calculations experimental data, identify metallurgical mechanisms regard rework or repair may be encountered transition period from Sn-Pb Pb-free soldering. Thermodynamic have been carried out study material possible formation intermetallic precipitates during reaction between Sn-Ag-Cu alloys. Two alloys relevant current industrial interests, namely Sn-3.9Ag-0.6Cu Sn-3.0Ag-0.5Cu were reacted different contamination levels eutectic Sn-37Pb solder. variables related materials processes, such as composition, temperature cooling rate, primary concerns respect resultant microstructures, which also studied experimentally using optical scanning electron microscopy (SEM). results this work provide guidance consequence for microstructural evolution hence mechanical integrity when small amounts Pb exist