Effects of Pb content on solidification behavior and microstructure on mixed solder alloy
作者： Wei Xiongfeng , Li Xunping , Zhoubin , Wei Guoqiang
DOI: 10.1109/ICEPT.2013.6756607
关键词:
摘要: The influence of different Pb content on solidification behavior, formation and evolution microstructure in mixed solder alloy were investigated. It has been shown that the onset temperature DSC cooling curve decreased with increasing or decreasing ball's volume. When reached 21.90wt.%, behavior was dominated by eutectic Sn-Pb alloy. addition resulted coarsening dentritic β-Sn matrix significantly, a low melting Sn-Ag-Pb ternary easily.
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