The effect of Pb content on the solidification behavior and shear performance of Sn3.0Ag0.5Cu/Cu joint
作者： Xunping Li , Bin Zhou , Xiongfeng Wei , Yunfei En , Xin Wang
DOI: 10.1109/ICRMS.2014.7107173
关键词:
摘要: The effect of Pb content in the rang 0∼37wt.% on solidification behavior and shear performance Sn3.0Ag0.5Cu/Cu joint was investigated. It shown that contamination showed a significant influence joint. A little amount resulted formation ternary eutectic Sn-Pb-Ag phase with low melting temperature mushy region between primary during stage mixed zone decreased increasing disappeared when solder matrix exceeded 18.34wt.% addition has been to be beneficial improve force SAC/Cu by using ball test method single interface parabolic relationship content. had no obvious
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