The effect of Pb contamination on the solidification behaviors and mechanical properties of backward compatible solder joints

作者: Li Xunping , Zhou Bin , En Yunfei , He Xiaoqi , Wei Xiongfeng

DOI: 10.1109/IPFA.2013.6599239

关键词: MetallurgyStress (mechanics)SolderingShearing (physics)Slip (materials science)MicrostructureShear (sheet metal)Shear forceMaterials scienceShear stress

摘要: The Pb contamination on the solidification behaviors and shear properties of Backward Compatible solder joints were investigated. behavior joint examined by using a DSC instrument, it was found that addition in Sn3.0Ag0.5Cu would change primary phase during microstructure backward compatible joint, meantime, is easy form low melting temperature Sn-Ag-Pb ternary eutectic alloy, pasty rang between two endothermic(or exothermic) peak decreases with increasing content matrix. discrepancy results different microstructures significantly. average sizes β-Sn IMC particles(Ag3Sn Cu6Sn5) matrix are larger than those relatively. However, force mixed higher SAC/Cu independent when less 30 wt.% ball test, seems has little influence single interface as-solidified condition. apparently facilitated slip stress release under to some extent.

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