作者: Joerg-Uwe Meyer , Martin Schuettler , Oliver Scholz , Werner Haberer , Thomas Stieglitz
DOI: 10.1007/978-1-4615-0231-9_6
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摘要: Miniaturization of electronic components, sensors and actuators as well advances in high density interconnects hybrid integration provide a challenging technology base to the medical industry for developing new bread devices that interface directly cells tissues. Examples advanced microimplants instruments include systems controlled drug delivery, cell sensing, tissue inspection, body fluid handling neural stimulation. In this chapter we describe which are characterized by an array multiple fine pitched microelectrodes novel interconnects, assembly techniques, biocompatible packaging procedures have been developed.