Reliability assessment of a thin (flex) BGA using a polyimide tape substrate

摘要: Wireless communication customers require thinner, smaller footprint packaging to allow for reduction in phone and paging product sizes. Currently, the thin MAP (mold array process) BGA package is production which converted from glob-top reduce overall profile 1.60 1.30 mm. limitations are substrate routing on finer geometries or more dense designs meeting thickness requirement (1.1 mm max. before collapse). In addition, major issues were experienced with manufacturing of due warpage. The fleXBGA/sup TM/ a that uses polyimide tape as 1.1 This paper reviews results evaluation this new compared BGA. report discusses how processing addressed flex critical considerations using /spl les/0.1 thick solder joint reliability, moisture effects (preconditioning, vapor phase reflow, autoclave temperature cycling), coplanarity, warpage performance when BT resin substrates. advantages disadvantages included. manufacturability reliability package. Also included discussion comparing wire-bond solution flip-chip version A comparison made feasible than flip-chip. includes design must be required pin-out.