Optimization of thermal interface materials for electronics cooling applications
作者： V. Singhal , T. Siegmund , S.V. Garimella
DOI: 10.1109/TCAPT.2004.828587
关键词:
摘要: Thermal interface materials (TIMs) are used in electronics cooling applications to decrease the thermal contact resistance between surfaces contact. A methodology determine optimal volume fraction of filler particles TIMs for minimizing is presented. The method uses finite element analysis solve coupled thermo-mechanical problem. It shown that there exists an which depends not only on distribution a TIM but also thickness layer, pressure and shape size particles. alleviation factor defined quantify effect these parameters conductance with use TIMs. For matrix considered-platelet-shaped boron nitride silicone matrix-the maximum observed enhancement was by as much nine.
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