Advancement in modeling vapor pressure induced stresses in electronic packaging

摘要: Reliability defect associated with thermal and humidity environment is not a new issue in modern electronics packaging. Moisture entrapment causes localized vapor pressure build up leads to pop-corning or delamination the internal structures when subjected reflow temperature. It was normally assumed that moisture entrapped inside polymeric material saturated state where can raised ∼5MPa at 260°C which may cause any resultant stress field change catastrophic failure. The approach proposed here utilized Pressure-specific volume-Temperature (P-v-T) properties of water determine corresponding induced. This open possibility developed be higher than 5MPa potentially explain failure such as pop-corning. modeling framework leverage sequential diffusion analysis custom subroutine incorporate induce strain finite element computation. Two case studies demonstrated feasibility this advance methodology describe mechanism.