Electronic Packaging Moisture Interaction Study

摘要: Reliability defects associated with thermal humidity environments are not new to the electronics packaging industry, yet this day it remains a key concern even for our latest technologies. Moisture absorbed into electronic can impact package warpage, cause corrosion, underfill crack and interfacial delamination. Fundamental studies needed better understand effect of moisture interaction different designs. This paper summarizes lab experiments Finite Element Analysis (FEA) that have been performed study absorption-desorption, room temperature (RT) warpage dynamic on packages post exposure environment. has yielded good fundamental learning identified areas future work.