Ti–Cu Coatings Deposited by a Combination of HiPIMS and DC Magnetron Sputtering: The Role of Vacuum Annealing on Cu Diffusion, Microstructure, and Corrosion Resistance

摘要: Titanium-copper (Ti–Cu) coatings have attracted extensive attention in the surface modification of industrial and biomedical materials due to their excellent physical chemical properties biocompatibility. Here, Ti–Cu are fabricated using a combination high-power pulsed magnetron sputtering (HPPMS; also known as high power impulse (HiPIMS)) DC followed by vacuum annealing at varied temperatures (300, 400, 500 °C). X-ray diffraction (XRD), transmission electron microscopy (TEM), photoelectron spectroscopy (XPS) data showed that Ti, Cu, CuTi3 mainly formed before annealing, while Ti3O, Cu2O, main compounds present annealed coatings. The cross-sectional TEM micrographs corresponding EDS results provided evidence Ti is on interfaces silicon substrate °C, bulk enriched with Cu. resistivity decreased increasing temperature from 300 °C. Based self-corrosion current density data, coating °C similar corrosion performance compared as-deposited coating, rate increased for 400 Stable release copper ions PBS (cumulative released concentration 0.8–1.0 μM) up 30 days was achieved all Altogether, demonstrate simple viable approach tune Cu diffusion microstructure coatings, thereby modulating electrical resistivity, performance, ion behavior.