Polyimide solvent cast films having a low coefficient of thermal expansion and method of manufacture thereof
作者： Roy Ray Odle , Tara J. Mullen , Kwok Pong Chan , Erik Hagberg
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摘要: A solvent cast film comprises a polyimide comprising structural units derived from polymerization of dianhydride component selected the group consisting 3,4'-oxydiphthalic dianhydride, 3,3'-oxydiphthalic 4,4'- oxydiphthalic and combinations thereof, with diamine 4,4'-diaminodiphenylsulfone; wherein has glass transition temperature 1900°C to 400°C; coefficient thermal expansion less than 60 ppm/°C, thickness 0.1 250 micrometers, endless 5% residual by weight.
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