Method for manufacturing a wholly aromatic polyimide resin having improved heat resistance and elongation properties in a high temperature range

作者: Jin Soo Kang , Yong Jae Hwang

DOI:

关键词:

摘要: The present invention relates to a method for manufacturing wholly aromatic polyimide resin having good mechanical properties and improved heat resistance, more particularly, that has resistance elongation tenacity in high temperature range, wherein the comprises: solution polymerization of two types tetracarboxylic acid dianhydride are controlled proportion, diamine. While retaining virtually all characteristics polyimide, manufactured according such it can be applied as an important material semiconductor industry aerospace field, which require higher levels excellent properties.

参考文章(14)
Junichi Imaizumi, Koji Fujisaki, Noriyuki Kinjo, Shun-ichi Numata, Yoshikatsu Mikami, Low thermal expansion resin material and composite shaped article ,(1984)
Yoshiaki Echigo, Akira Shigeta, Hirohisa Katou, Kazuyoshi Nagata, Polyimide precursor solution, transfer/fixing member and process for producing polyimide seamless belt ,(2003)
Chang-Jin Lee, Seo-Bong Lee, Un-Kyung Kim, Myung-Hoon Lee, Mi-Sun Ryu, Stable polyimide precursor and its preparation method ,(1997)
Kimiteru Tagawa, Hideaki Oikawa, Moriji Morita, 英明 及川, Shigeo Koba, 繁夫 木場, 守次 森田, 健二 田辺, 公照 田川, Kenji Tanabe, Polyimide film and metallic foil laminated body and manufacture thereof ,(1993)