High‐Efficiency Thin‐Film Superlattice Thermoelectric Cooler Modules Enabled by Low Resistivity Contacts

摘要: V-telluride superlattice thin films have shown promising performance for on-chip cooling devices. Recent experimental studies indicated that device is limited by the metal/semiconductor electrical contacts. One challenge in realizing a low resistivity contacts absence of fundamental knowledge physical and chemical properties interfaces between metal materials. Here we present combination theoretical efforts to understand, design harness V-tellurides. Ab initio calculations are used explore effects interfacial structure compositions on contacts, an ab based macroscopic model employed predict limit contact as function both carrier concentration temperature. Under guidance studies, develop approach fabricate film superlattices, achieving 100-fold reduction compared previous work. Interfacial characterization analysis using scanning transmission electron microscopy energy-dispersive x-ray spectroscopy show unusual morphology potential further improvement resistivity. Finally, improved realize high-performance thermoelectric module.