作者: Yee Rui Koh , Kazuaki Yazawa , Ali Shakouri
DOI: 10.1016/J.IJTHERMALSCI.2015.06.004
关键词: Coefficient of performance 、 Thermoelectric materials 、 Thermoelectric effect 、 Nuclear engineering 、 Electronics 、 Thermal conductivity 、 Active cooling 、 Seebeck coefficient 、 Thermoelectric cooling 、 Materials science
摘要: Abstract We report a scalable and parametric analysis of thermoelectric (TE) microcoolers for hotspot cooling based on analytic formulations. Design minimizing power least mass or cost TE material is an ultimate goal electronic devices that require spot beyond provided by passive heat transport to the thermal ground. Performance depends external resistances, physical dimension (thickness) element, applied drive current. Active located at minimizes internal generation from element also additional driving used rejection with preexisting air-cooling fan liquid-cooling pump. Electronic are required operate below specific temperature functionality high reliability. The cooler must be designed deal amount generated source this constraint. investigate two design cases: 1) maximum 2) minimum current given obtain improved coefficient-of-performance (COP). study explores impact individual properties, i.e. Seebeck coefficient, electrical conductivity, conductivity find direction should taken engineered materials. show COP up 8 possible fluxes about 80 W/cm 2 , if leg thickness optimized ∼20–30 microns today's Bi Te 3 material. Model shows > 2–3 bigger than 200–300 W/cm . lowering have greatest impact, resulting in thinner (and therefore lower cost) while maintaining same figure-of-merit (ZT).