Effect of Thermoelectric and Electrical Properties on the Cooling Performance of a Micro Thermoelectric Cooler
作者： Kong Hoon Lee , Hyunse Kim , Ook Joong Kim
DOI: 10.1007/S11664-010-1285-2
关键词:
摘要: Active cooling has been studied to prevent microprocessor temperature rise due hot spots, and a micro thermoelectric cooler is promising candidate for this spot since it can be used effectively cool the small area near spot. Numerical analysis conducted determine effect of electrical properties on performance such cooler. In considered herein, Bi2Te3 Sb2Te3 were selected as n- p-type materials, respectively. The column was 20 μm thick. coefficient (COP) rate primary factors evaluate Although varies with thermal conditions thermophysical difference, present study only focuses Seebeck resistivity.
harvard.edu
springer.com
sci-hub.se 参考文章(5)
David Michael Rowe, CRC Handbook of Thermoelectrics CRC Press. ,(1995) , 10.1201/9781420049718
Luciana W. da Silva, Massoud Kaviany, Micro-thermoelectric cooler: interfacial effects on thermal and electrical transport International Journal of Heat and Mass Transfer. ,vol. 47, pp. 2417- 2435 ,(2004) , 10.1016/J.IJHEATMASSTRANSFER.2003.11.024
R.C. Chu, R.E. Simons, M.J. Ellsworth, R.R. Schmidt, V. Cozzolino, Review of cooling technologies for computer products IEEE Transactions on Device and Materials Reliability. ,vol. 4, pp. 568- 585 ,(2004) , 10.1109/TDMR.2004.840855
Kong Hoon Lee, Ook Joong Kim, Analysis on the cooling performance of the thermoelectric micro-cooler International Journal of Heat and Mass Transfer. ,vol. 50, pp. 1982- 1992 ,(2007) , 10.1016/J.IJHEATMASSTRANSFER.2006.09.037
A. Shakouri, Gehong Zeng, Yan Zhang, Silicon Microrefrigerator IEEE Transactions on Components and Packaging Technologies. ,(2006)