Finite element analysis of miniature thermoelectric coolers with high cooling performance and short response time
作者： Wei Zhu , Yuan Deng , Yao Wang , Anliang Wang
DOI: 10.1016/J.MEJO.2013.06.013
关键词: Mechanical engineering 、 Response time 、 TEC 、 Substrate (building) 、 Thermoelectric cooling 、 Microelectronics 、 Thermal resistance 、 Finite element method 、 Numerical analysis 、 Engineering
摘要: The miniature thermoelectric cooler (TEC) is a promising device for microelectronics applications with high cooling performance and short response time. In this paper, a …
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