Out-of-Plane CTE Measurement Method for Freestanding Thin Films
作者： A. E. Mag-isa , S.-M. Kim , J.-H. Kim , H.-J. Lee , C.-S. Oh
DOI: 10.1007/S11340-012-9702-5
关键词:
摘要: An out-of-plane linear coefficient of thermal expansion (CTE) measurement method was developed to overcome the difficulty in measuring in-plane deformation freestanding thin films with a thickness less than 1 μm. The profile relatively easy added advantage simplicity, specimen preparation, and simple test setup. White light interferometry used for determining as function temperature. Two types supporting substrates, silicon ZERODUR®, were account substrate effect on CTE measurement. Attempts made fit measured profiles using several peak functions then find optimal one. procedures demonstrated 530-nm-thick aluminum film that previous method. calculated value this 23.7 ppm/°C, which good agreement result. incorporating zero shown be most convenient straightforward
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