Multi-chip stack package structure and fabrication method thereof
作者： Pin-Cheng Huang , Chi-Hsin Chiu , Chun-Chieh Chao
DOI:
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摘要: A multi-chip stack package structure includes: an inner-layer heat sink having a first surface and second opposing one another plurality of conductive vias penetrating the surface; chip disposed on sink; sink. Thereby, heat-dissipating path is provided within inner-layers structure, rigidity overall enhanced.
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