Enhanced interconnection to ceramic substrates
作者： Robert W. Pasco , Srinivasa S. N. Reddy , Rao V. Vallabhaneni
DOI:
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摘要: A semiconductor chip interposer increases fatigue life of interconnections between a first component having relatively high thermal coefficient expansion (TCE) and second low TCE. The includes thin metal plate plurality through holes, the TCE intermediate An insulation coating on is also included walls holes. electrical conductive material fills each insulated holes for interconnection component.
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