Method of fabricating a chip interposer
作者： Pieter Geldermans , Gangadhara Swami Mathad
DOI:
关键词:
摘要: Disclosed is a method of fabricating multichip interposer comprising an insulating support with thin film fine line metallization on one side thereof. A layer masking material adhered to in other and selective areas the are removed desired pattern expose support. The exposed then etched until reached form via holes which subsequently filled interconnecting metallurgy. Contact pads formed around each hole.
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