Capacitive chip carrier and multilayer ceramic capacitors

摘要: A chip carrier system for supporting electronic semiconductor chips is provided with a matched coefficient of thermal expansion as well high value capacitance. The provides both mechanical and electrical connections to the chip. small sized interposer silicon possesses An array dot capacitors formed between laminated layers ceramic material. In some cases, conductive surfaces are on upper lower thin film material in which dielectric bodies interspersed an openings therein. resultant combination has matches substrate thereby relieving stress upon solder ball joints substrate. This minimizes during cycling structure. Alternatively, multilayer located within holes capacitor plates, or entire arrays space sheets.