High performance integrated circuit chip package

摘要: A high performance integrated circuit chip package includes a support substrate having conductors extending from one face to the opposite thereof and multilayer wiring on of for connecting chips mounted thereon another conductors. heat sink microchannels at thereof, with thermally conductive cushions exposed back sides chips, provide density dissipation. The may be formed blocks material thermal expansion matching silicon. are low melting point solder, preferably pure indium, sufficiently thick absorb stresses, but thin efficiently conduct sink.