作者: John W. Smith , Thomas H. DiStefano
DOI:
关键词: Electronic engineering 、 Heat sink 、 STRIPS 、 Thermal expansion 、 Electrical conductor 、 Planar 、 Cable gland 、 Composite material 、 Materials science 、 Microelectronics 、 Fabrication
摘要: A thermal connector for conducting heat from microelectronic components such as semiconductor chips to a sink. The includes large number of flexible conductors desirably formed elongated "S"-shaped strips or ribbons. can flex accommodate tolerances in the assembly and displacement caused by expansion. may have relatively thin neck sections increase flexibility conductors, be fabricated process which fabrication flat strips, bonding pair opposed planar sheets vertically moving away one another expand their final three-dimensional configuration.