Microelectronic assembly fabrication with terminal formation from a conductive layer

摘要: A structure including a conductive, preferably metallic conductive layer is provided with leads on bottom surface. The have fixed ends permanently attached to the and free detachable from structure. engaged microelectronic element such as semiconductor chip or wafer, of are bonded element, bent by moving relative element. Portions removed, leaving residual portions separate electrical terminals connected at least some leads. mechanically stabilizes before bonding, facilitates precise registration After converted terminals, it does not impair movement