Semiconductor chip assemblies and components with pressure contact
作者： Igor Khandros , Gaetan Mathieu , Gary Grube
DOI:
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摘要: A semiconduct chip assembly includes a chip, terminals permanently electrically connected to the by flexible leads and resilient element or elements for biasing away from chip. The is engaged with substrate having contact pads so that are disposed between engage under influence of force applied element. typically provided on sheet-like dielectric interposer can be tested prior engagement substrate. Because this does not involve soldering other complex bonding processes, it reliable. extremely compact may occupy an area only slightly larger than itself.
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