Method of packaging integrated circuit chips, and integrated circuit package

摘要: An integrated circuit package comprises at least two chips each having a plurality of contact pads arranged in first pattern on the interconnect face chip, and an elastic sheet-form member. The member has main areas, associated with respectively, dielectric material conductor runs supported by mutually electrically insulated relationship termination points second patterns areas respectively corresponding respectively. is confronting area member, chip are registering relationship. A metallurgical bond formed between pad point. assembly placed between, pressure with, essentially rigid enclosure members, thermally-conductive back one being made that good thermal conductivity.