Compressive pedestal for microminiature connections

摘要: Apparatus is disclosed for providing microelectronic, intra-chip and chip-to-chip interconnections in an ultra-dense integrated circuit configuration. Compressive pedestals 20 are used to form spring-loaded electrical mechanical conductive terminals on a chip interface mesa assembly 28 order large multi-chip array 23 interconnection substrate 24. Methods also fabricating the compressive 20.