Ceramic package type semiconductor device and method of assembling the same
作者： Shigeki Harada , Nobutaka Shimizu , Takehisa Tsujimura , Masahiro Sugimoto
DOI:
关键词:
摘要: A ceramic package type semiconductor device comprising: a substrate having wiring pattern layer formed on top surface thereof; at least one element mounted the with face thereof facing downward and electrically connected to patttern layer; metal cap through-hole corresponding an external size of end portion soldered substrate, so that bottom fitting into form flat plane: heatsink member comprising plate which is plane complete hermetic sealing element.
google.ch 参考文章(17)
Nobuyuki Ushifusa, Satoru Ogihara, Hironori Kodama, Kanji Otsuka, Integrated circuit package (1111111) ,(1984)
Yoshiaki Wakashima, Method of fabricating a resin mold type semiconductor device ,(1982)
Kurt Hintzmann, Dieter Mutz, Arnim Wingert, Reinhold Kaiser, Manfred Salomon, Wolfgang Link, Willy Minner, Integrated circuit arrangement with means for avoiding undesirable capacitive coupling between leads ,(1978)
Yoshiaki Itoh, Yusuke Odani, Nobuhito Kuroishi, Kiyoaki Akechi, Aluminum-silicon alloy heatsink for semiconductor devices ,(1987)
Yasumasa Wakasugi, Shigeki Harada, Masahiro Sugimoto, Heatsink package for flip-chip IC ,(1986)
Jaroslav Hynecek, Wen H. Ko, Eugene T. Yon, Miniature pressure transducer for medical use and assembly method Delphion Inc., www.delphion.com. ,(1975)
Dimitry G. Grabbe, Semiconductor chip carrier system ,(1987)
Harry R. Bickford, Michael J. Palmer, Lawrence S. Mok, High power, pluggable tape automated bonding package ,(1989)
Satyam C. Cherukuri, Sheldon H. Butt, Process for producing a hermetically sealed package for an electrical component containing a low amount of oxygen and water vapor ,(1987)
Thomas J. Dunaway, Richard K. Spielberger, Lori A. Dicks, Low-cost high-performance semiconductor chip package ,(1989)