作者: Harry R. Bickford , Michael J. Palmer , Lawrence S. Mok
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摘要: A TAB package is described which includes a flexible dielectric film (30) with an outer edge, back and front faces aperture therein. The face, as conventional, provided plurality of beam leads (31), extend into the connect to semiconductor chip (34). Thermally conductive body means (10) has well (18) formed therein, defined by lip (22) comprising rim (20) means. face thermally connected conform surface over its whereby also structure. are thereby made available for electrical connection in vicinity rim. Means (40, 42) attaching edge so enable flexure event differential expansion or contraction at points.